Micro LED Prospective Technology: Mass Production Technology

 

Massive transfer is one of the biggest technical bottlenecks in Micro LED display screen technology. The industry is currently developing its technology in full swing, hoping to break through the barriers as soon as possible and promote the commercialization of Micro LEDs. In this Micro LED forward-looking technical essay competition, the huge transfer technology is also the focus of many entries.

 

 

Among them, the research paper by Mr. KeQuan, Thomas Q. Ke, proposed the mass production mode of Micro LED without huge transfer. The paper pointed out that by redesigning the manufacturing process of Micro LEDs and using existing technologies, it is possible to effectively avoid the huge transfer process that is time-consuming and labor-intensive. The paper proposes to keep the Micro LED on the epitaxial substrate, remove the 3/4 Micro LED wafer, fill the hole with PI, and then make the drive circuit next to the remaining 1/4 LED. In this way, the RGB Micro LED display screen can be produced without a huge transfer process.

 

The review of the paper collection pointed out that the technical method of integrating the driver circuit on the Micro LED wafer is similar to that of Lumiode, eMagin, NthDegree, OSRAM and other companies. In addition to the process and materials, the biggest difference between the proposed solution and other technologies is that 3/4 of the LED wafer material is discarded, and the extra space is exchanged for the placement of the RGB staggered and drive circuits.

 

In order to save a lot of cost and time that may be caused by massive transfer, this research paper chooses to exchange the cost of materials. Such a technical orientation may be able to gain an advantage in mass production before the mass transfer technology has yet to mature. However, once the technology of mass transfer is improved and the cost is gradually reduced, falling below four times the cost of materials, this approach no longer has an advantage.